Solder Paste with Syringe Plunger SN63 PB37 BGA Flux Soldering Tin Cream Repair

Description

Mechanic High Synthetic BGA Solder Flux Paste BGA Soldering Tin Cream XG-Z40
Describe:
MECHANIC XG-Z40 High synthetic BGA Solder Flux Paste Soldering Tin Cream 10ml solder paste tin. Applicable to PCB, BGA, SMD, PGA repair repair. Mechanic solder tin paste xg-z40 Solder Paste Flux Sn63/Pb37 25-45um Syringe to Mobile Phone Repair Services Indust
Features:
MECHANIC XG-Z40 High synthetic BGA Solder Flux Paste BGA Soldering Tin Cream
PCB BGA Soldering Paste Flux Solder BAG Ball Flux Paste
The BGA Flux Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips.
It is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue, so you are easy to clean the board.
Soldering paste for cell phone PCB and SMD etc.
Help to repair the circuit boards and protect the electronic components
A necessary material for repairing the mobile phone mainboard
Flux Solder Paste - no clean soldering
MECHANIC BGA Solder Flux Paste Soldering Tin Cream
Specification:
Material: tin+solder paste
Color: As picture shown
Size: Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm
Type: XG-Z40
Alloy: Sn63/Pb37
Microns: 25-45um