Solder Flux Paste Soldering Tin Creams Welding Fluxes SMD Phone Tool For PCB/BGA

Description

100% Brand New, High Quality.
Feature:
Type: XG-50
Material: plastic+solder paste
Size: approx.1.30*1.30*1.14 inch / 3.3*3.2*2.9cm
Alloy: Sn63/Pb37
Microns: 25-45um
Viscous force lasting, not easy to dry.
Application: mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
Package included:
1pc x solder paste