Sn6/Pb67 Welding Fluxes Solder Paste Flux XG-50 SMT BGA Reballing Lead 25-45um

Description

sunshinylight04
Product Description
Description:
Features:
Suitable for smart phone repairing, electronic industrial BGA reballing.
Fine soldering part, stable and smooth performance. High quality.
Specification:
Model: 6337
Viscosity: 37 Pa.S
Granularity: 1 um
Working Temperature: 183℃
Weight: approx. 37 g
Included:
1 X Lead Paste
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