For PCB/BGA SMD Phone Tool Solder Flux Paste Soldering Tin Cream Welding Fluxes

Description

Specification:
Brand new
Type: XG-50
Material: plastic+solder paste
Size: approx.1.30*1.30*1.14 inch / 3.3*3.2*2.9cm
Alloy: Sn63/Pb37
Microns: 25-45um
Viscous force lasting, not easy to dry.
Application: mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
Package included:
1pc x solder paste
Note:
Please allow 1-5mm errors due to manual measurement.
Item color displayed in photos may be showing slightly different on your computer monitor since monitors are not calibrated same.
On May-19-21 at 18:46:14 PDT, seller added the following information: