-40%
Flux For BGA CSP Ch 10CC For PCB SMT IC LeadFreefor PCB PGA SMD BGA IC
$ 4.77
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Description
Flux For BGA CSP Ch 10CC For PCB SMT IC LeadFreefor PCB PGA SMD BGA ICDESCRIPTION
Flux For BGA CSP Ch 10CC For PCB SMT IC LeadFreefor PCB PGA SMD BGA IC
feature:
1. Good adhesion. The paste is fine and the particles are small, only 20~38 microns.
2. Excellent wettability. After opening, the surface remains wet for 36 hours. Does not affect welding.
3. Solder paste, 183℃, melting point, easy to solder, easy to form
4. Unique formula, perfect performance, easy to weld, bright and full, no virtual welding, virtual welding, etc.
Application: mobile phone chip repair, computer and digital service industry, high-precision circuit board SMT welding, BGA welding process,. The melting point of solder paste at room temperature is 183°C/molding, which is fast and easy to solder
Details:
Viscosity: 160-230Pa
Dimensions: 20-38um
Merge point content model.
RL-400 20g 183℃
RL-401 30g 183℃
RL-402 40g 183℃
RL-403 10cc183℃
Package includes:
1*Solder Paste
1* Needle
1*Booster
POLICES
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It takes about
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