-40%
BGA Activated Rosin Solder Paste Tin Rosin-Based Flux Paste Cream for
$ 7.66
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BGA Activated Rosin Solder Paste Tin Rosin-Based Flux Paste Cream for
Product Description
MECHANIC Advanced Paste Flux Soldering for mobile phone motherboard Repair, electric Soldering Iron Welding Fluxes for phone circuit board repair. Its boiling point only slightly higher than the melting point of the solder, For mobile phones, PC cards and other sophisticated electronic chip-level help welding. High bond strength, PH value neutral, insulation is strong, welding surface smooth, is no corrosive for IC and PCB. Wipe the surface of the object before soldering, apply the paste flux to the solder joint, solder the tin to the solder joint with soldering iron. Specifications: Model: MECHANIC-UV80; Color: Yellow, Weight: 0.08kg; Viscosity: 0.2Pas; Granularity: 0.22um; Packing: Aluminum box.
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