-40%

AMTECH VS-213A-TF Universal No-clean Tacky Solder Flux (ROL0) 150g Jar

$ 55.43

Availability: 13 in stock
  • Return shipping will be paid by: Buyer
  • Brand: Amtech
  • Condition: New
  • Refund will be given as: Money back or replacement (buyer's choice)
  • Modified Item: No
  • MPN: 16704
  • Country/Region of Manufacture: United States
  • Form of Packaging: Jar
  • Custom Bundle: No
  • Form: Paste
  • Non-Domestic Product: No
  • All returns accepted: Returns Accepted
  • Item must be returned within: 30 Days

    Description

    AMTECH VS-213A-TF Universal No-clean Tacky Solder Flux
    VS-213A-TF
    performs at par with bestselling AMTECH no-clean ROL0 fluxes
    NC-559-ASM/V2, RMA-223 and SynTECH
    , however, it is uplifted with some highly desirable modern add-ons, missing from its grand counterparts -
    VS-213A-TF
    is
    REACH compliant, halogen-free and universal
    - supports both leaded and lead-free alloys.*
    VS-213A-TF
    retains all greatly admired AMTECH's no-clean context - industrial wetting capabilities, optimal tack/viscosity, long-lasting performance, clear residue and easy cleaning.
    *In contrast NC-559-ASM/V2, RMA-223 and SynTECH would all require special LF version to solder lead-free alloys, VS-213-A is a universal high-performance flux for high-reliability applications either leaded or lead-free will be certified and compliant with the most rigorous standards like REACH and the most demanding specifications
    AMTECH
    Advanced Solder Chemicals *
    VS-213A
    Classification
    J-STD-004-B
    ROL0
    Designation
    IPC-TM-650 2.3.35
    Lead-free
    Process
    No-clean
    Tacky Flux
    Speciality
    Halogen-free
    Highly versatile
    Compatibility with alloy systems
    Universal
    Sn/Pb & Lead-free
    Viscosity - Flux
    Malcom @ 10 RPM/25°C (x103mPa/s)
    IPC-TM-650: 2.4.34.4
    40-65
    Matching AMTECH
    Core Wire
    Rosin Core
    No-clean
    NC-61
    Solder Paste
    Stencil Life
    @ 30-45% RH & 20-25°C
    @ 45-75% RH & 20-25°C
    >12 hours
    ~ 4 hours
    Viscosity - Printing
    Malcom @ 10 RPM/25°C (x103mPa/s)
    IPC-TM-650: 2.4.34.4
    120-185
    SAC305 T3/T4
    Viscosity - Dispensing
    Malcom @ 10 RPM/25°C (x103mPa/s)
    IPC-TM-650: 2.4.34.4
    105-150
    SAC305 T3/T4
    Tack Value
    IPC-TM-650: 2.4.44
    34g
    Surface Insulation Resistance
    85°C, 85% RH @ 168 Hours
    IPC-TM-650: 2.6.3.7
    L: ≥100 MΩ (no-clean)
    IPC Test Results
    Corrosion
    IPC-TM-650: 2.6.15
    L: No corrosion
    Quantitative Halides
    IPC-TM-650: 2.3.28.1
    L: <0.05%
    Copper Mirror
    IPC-TM-650: 2.3.32
    L: No breakthrough
    Electrochemical Migration
    IPC-TM-650: 2.6.14.1
    L: <1 decade drop (no-clean)
    Alloys Compatibility
    Sn42/Bi58 (Eutectic)
    138°C
    Sn42/Bi57.6/Ag0.4
    140°C-139°C
    Sn43/Pb43/Bi14
    163°C-144°C
    Sn62/Pb36/Ag2 (Eutectic)
    179°C
    Sn62.8/Pb36.8/Ag0.4
    183°C-179°C
    Sn63/Pb37 (Eutectic)
    183°C
    Sn60/Pb40
    188°C-183°C
    Sn96.5/Ag3.0/Cu0.5
    219°C-217°C
    Sn99/Ag0.3/Cu0.7
    221°C-217°C
    Sn96.5/Ag3.5 (Eutectic)
    221°C
    Sn99.3/Cu0.7 (Eutectic)
    227°C
    Sn95/Sb5
    240°C-235°C
    Sn95/Ag5
    245°C-221°C
    Sn10/Pb88/Ag2
    X
    Compliance
    RoHS II
    Directive 2011/65/EU
    RoHS II
    COMPLIANT
    EICC
    Conflict Minerals Compliance
    EICC
    COMPLIANT
    REACH
    Articles 33 and 67 of Regulation (EC)
    No 1907/2006
    REACH COMPLIANT
    (Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials)
    AMTECH
    Advanced Solder Chemicals
    VS-213A
    Safety Notice
    This product is designed for the professional audience. The information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having relevant skills at their own risk. Consumers of AMTECH products should make their own tests to determine the suitability of each product for their particular process and take safety measures. Manufacturer/resellers assume no liability for results obtained or damages incurred through the application of the data presented.
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