3x MECHANIC Solder Flux Paste PCB BGA reflow Welding XGSP80 SN63 Pb37 Infrared

Description

Title:  3x MECHANIC Solder Flux Paste Cream for BGA Reball Welding XGSP80 SN63Pb37 SMT
Shipped with USPS tracked (USA 3-5 business days)
Shipped with Canada Post (Canada)
Contents:
2 qty - MECHANIC XGSP80 (60g bottles) SN63Pb37 Solder Paste IPX3 Flux  [183°C Low melting point]
1 qty - MECHANIC XGZ40 (35g plunger) SN63Pb37 Solder Paste IPX3 Flux [183°C Low melting point]
1 qty - random shape MECHANIC metallic scraper
1 qty - small flexible card for scraping purposes
Specifications:
Model: XGSP80, XGZ40
Sn Content: 63.0%
Pb Content: 37.0%
Gross Weight: 60.0g (bottles), 35.0g (plunger)
Melting Point: 183℃
WHAT IS IT FOR?
Applications include SMT repair, SMT manufacturing, smartphone repair, motherboard repair, BGA reballing, or SMD component repair
Precautions:
Must be used with adequate ventilation when heating/welding
Avoid repeated contact with skin. The solder paste contains organic solvent. If the solder paste gets on your skin, wipe it off with alcohol and rinse thoroughly with soap and water.
Use gloves and avoid contact with the pastes, use scraping tool provided, and avoid any part of your body exposed to the vapours as well as avoid inhaling them
Avoid contact with eyes
Keep away from children or pets
If you have any questions,
feel free to send me a message.
Thanks for looking.
Have a nice day!